Advantech UTX-3117

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Gruppi di prodotti > Embedded PC > Advantech UTX-3117

Advantech UTX-3117

Intel® Atom® E3900/Celeron® N3350/Pentium® N4200 series fanless IoT gateway

Advantech UTX-3117
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  • ProprietàProprietà
  • DescrizioneDescrizione
  • Further informazioniFurther informazioni
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  • Intel® Apollo Lake E3900 series & N series Processor
  • Palm-size form factor: 128 (L) x 152 (W) x 37 mm(H)
  • Supports 2 x COM port, 1 x HDMI, 1 x Display Port, 2 x USB3.0, TPM and DCIN 12~24V
  • Built-in 1x M.2 expansion slot (i.e.: Wi-Fi module), 1 x Half size Mini PCIe expansion slot (i.e.: Zigbee, module or mSATA) and 1 x Full size Mini PCIeexpansion slot (i.e.: 3G/LTE module) with 5Antennas
  • Supports 1x 2.5" HDD or SSD storage
  • Wide operating temperature -20 ~ 60 °C support (With E3900 Series SoC)
  • Complete certification for Safety and RF (upon request)
  • Support OS: Windows 10, Linux OS
  • IoT SW integration: WISE-PaaS IoT software platform, AWS Greengrass, Microsoft IoT Edge

Advantech UTX -3117 is a plug & play IoT gateway to simplify your deployment with multi-connectivity, optimized thermal solution, wide range power input and IoT software integration which is ideal for smart city, smart retail, smart energy and industry 4.0.
ProdGrafik

Specifications

    Processor System

      CPU
      Intel Apollo Lake E3900 & N series Processor

      L2 Cache
      2MB

      BIOS
      AMI EFI 16 Mbit



    Memory

      Technology
      Dual channel DDR3L 1867MHz, up to 8GB

      Socket
      Two 204-pin SO-DIMM



    Graphics

      Chipset
      Intel Apollo Lake E3900 Series SoC
      Intel Apollo Lake N series SoC

      Interface
      HDMI: 1, max resolution up to 3840 x 2160 @ 30Hz
      DP1.2: 1, max resolution up to 4096 x 2160 @ 60Hz



    Ethernet

      LAN
      Support Dual 10/100/1000Mbps LAN
      LAN1: Intel I210AT
      LAN2: Realtek RTL8111G



    I/O Interface

      Serial Ports
      1 x RS-232 with 5v/12v and 1x RS-422/485 full duplex with Phoenix connector

      USB Interface
      2 USB3.0 port

      SATA
      1 SATA interface, support SSD

      TPM
      Infineon SLB9665 chip onboard. Support TPM2.0



    Expansion

      Mini PCIe
      1 x Half-Size Mini PCIe (PCIe Gen2 x1, SATA3, USB2.0 signal co-lay)
      1 x Full-Size Mini PCIe (USB2.0 signal with SIM holder to support LTE module)
      1 x M.2 E key (PCIe Gen2x1, USB2.0 co-lay)



    Storage

      2.5" SSD
      1 x SATA II SSD bay

      mSATA
      1, co-lay with H/S miniPCIE slot



    Software Support

      Microsoft Windows
      Windows 10, Ubuntu and WISE-PaaS



    Power Requirement

      Power Input Voltage
      12 ~ 24 V

      Power Adaptor
      AC to DC, DC12 ~ 24 V



    Power Consumption

      Typical
      12V * 0.35 (A), 4.2W

      Max
      12V * 0.61 (A), 7.32W

      Power Type
      AT/ATX by Jumper option



    Mechanical

      Construction
      Aluminum

      Mounting
      Support VESA/DIN Rail/Wall Mount (Optional)

      Dimensions (W x H x D)
      Chassis: 128(L) x 152 (W) x 37 mm(H)
      Motherboard: 123.3 x 129 mm



    Environmental and Certifications

      Operating Temperature
      E3900 Series SoC SKU -20 ~ 60 °C: with RF modules (under 0.7m/s air flow)
      N series SoC SKU -0 ~ 55 °C: with RF modules (under 0.7m/s air flow)

      Storage Temperature
      -40 ~ 85 °C

      Relative Humidity
      95% @ 40 °C (non-condensing)

      Vibration During Operation
      With SSD: 3Grms, 60068-2-64, random, 5 ~ 500 Hz, 1 hr/axis

      Shock During Operation
      With SSD: 30G, IEC 60068-2-27, half sine, 11ms duration

      EMC
      CE/FCC Class B

      Safety Certifications
      CCC




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